The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 1988
Filed:
Oct. 28, 1986
Norman G Ainslie, San Jose, CA (US);
Dwight W Brede, Los Altos Hills, CA (US);
A David Erpelding, San Jose, CA (US);
Surya Pattanaik, San Jose, CA (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
In a data disk file a slider is mechanically attached to the suspension by means of reflowed solder balls. A pattern of solder contact pads is formed on the back side of the slider and a similar pattern of solder-wettable regions is formed on the suspension. Solder balls are formed on either the solder contact pads or the solder-wettable regions, the slider is located on the suspension so that the solder balls are in registration between the solder contact pads and solder-wettable regions, and the solder is heated to reflow, thereby forming solder joints as a mechanical connection between the slider and suspension. When a thin film transducer is formed on the slider trailing edge and the suspension is a laminated type with patterned conductors, solder balls are also formed on the transducer lead terminations on the trailing edge and on a row of solder-wettable regions on the suspension near the location where the trailing edge of the slider is to be located. In this embodiment, when the slider with thin film transducer, with solder balls on the lead terminations, is located over the suspension then all of the solder balls are heated. The solder balls for providing mechanical connection collapse during reflow, thereby causing the solder balls on the transducer lead terminations to come in contact with and flow together with the solder balls formed on the row of solder-wettable regions on the suspension. Thus the mechanical attachment of the slider is made simultaneously with the electrical connection of the transducer lead to the disk file read/write electronics.