The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 1988

Filed:

Sep. 12, 1986
Applicant:
Inventors:

Hisashi Nishiyama, Yokohama, JP;

Seiichi Miyasaka, Yokohama, JP;

Tadatoshi Kamimori, Tokyo, JP;

Mamoru Mizuhashi, Yokohama, JP;

Akihiko Yoshihara, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F / ;
U.S. Cl.
CPC ...
350357 ;
Abstract

A method for fabrication of an electrochromic device having perfect tight closure of the cell, wherein two or more banks constituting an external frame for the substrates are formed with use of a sealing material at the peripheral positions on the surface of the first or second substrate where the electrode has been formed; then a gel-like electrolytic solution is placed on the surface of the first substrate; thereafter the second substrate is disposed with the surface side thereof where the electrode has been formed being opposed to the surface side of the first substrate where the electrode has been formed; and finally both first and second substrates are laid one on the other to be contact-bonded, and wherein the two or more banks are composed of one or more cured inner bank and an uncured outer bank; when the uncured outer bank is in the two-stage structure having a height taller than that of the inner bank, and is of such two-stage structure composed of a cured bank having a height shorter than that of the inner bank and an uncured bank laminated on the cured bank, such inner bank is provided one or more in number; and when the uncured outer bank is in a single stage structure, the inner bank is provided two or more in number with a space interval being provided between them, both first and second substrates being joined together by the contact-bonding.


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