The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 1988
Filed:
Jun. 23, 1987
Ray G Spiecker, Westford, MA (US);
RCA Corporation, Princeton, NJ (US);
Abstract
A leadless ceramic chip carrier (LCCC) is soldered to mating conductor pads on a circuit board by depositing a layer of solder paste on peripheral contact pads and on an array of central pads on the board. The same solder paste type and melt temperature are used for both peripheral and central pads. the contact pads of the LCCC are placed on the solder layers and the assembly exposed to infrared radiation from above or other energy source. The LCCC body shades the solder on the central pads resulting in the solder layers at the peripheral pads melting first. The solder on the central pads then melts and balls up due to surface tension lifting the LCCC away from the board stretching the melted solder at the peripheral pads which make the electrical connections to the LCCC contacts.