The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 1988
Filed:
Feb. 06, 1987
Applicant:
Inventor:
Bernard Greenstein, Glenview, IL (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ; B23K / ;
U.S. Cl.
CPC ...
228123 ; 228261 ; 22826312 ; 357 67 ; 357 71 ; 357 81 ; 427123 ; 427423 ;
Abstract
A semiconductor die is mounted on a metal substrate via intermediate layers which permit the die to be readily soldered to the combination while yet reducing thermal stresses. A dielectric layer is formed over the substrate, followed by another layer of a selected metal, either molybdenum or tungsten. Atop the metal layer is another layer comprising a mixture of solder and the selected metal. A layer of only solder is formed over the mixture, and the semiconductor die is bonded thereto by means of the layer of solder.