The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 1988
Filed:
Nov. 18, 1986
Applicant:
Inventors:
Kazuyoshi Ebe, Saitama, JP;
Hiroaki Narita, Saitama, JP;
Katsuhisa Taguchi, Saitama, JP;
Yoshitaka Akeda, Saitama, JP;
Takanori Saito, Saitama, JP;
Assignee:
FSK Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J / ; C09U / ; B05D / ;
U.S. Cl.
CPC ...
428343 ; 428345 ; 428901 ; 427 35 ; 427 541 ;
Abstract
An adhesive sheet according to the present invention comprises a substrate having coated on the surface thereof an adhesive layer consisting of an adhesive and a radiation polymerizable compound, said compound being a urethane acrylate oligomer having a molecular weight of 3,000-10,000, preferably 4,000-8,000. The adhesive sheet is preferably used in subjecting semiconductor wafers to dicing operation and no adhesive sticks to and remains on the back side surface of the wafer chip as picked up.