The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 1988
Filed:
Dec. 14, 1984
Donald F Sullivan, King of Prussia, PA (US);
Other;
Abstract
Densely packed high resolution printed wiring boards may be achieved by providing channels below grade in a substrate planar surface, thereby providing greater conductor width for closely spaced conductors. By mechanically removing the substrate surface between the channels, high virtual resolution is obtained with high quality conductors and insulation spacings of the order of about 0.003 inch, and with actual conductor widths of greater than 0.012 inch. Thus the packing density of printed wiring patterns may be increased significantly. Also the quality of conductor adherence and conductivity is improved. Thus a non-critical and inexpensive process unexpectedly provides an improved quality, more precise printed wiring pattern.