The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 1988
Filed:
Sep. 22, 1987
Kiyoshi Morimoto, Mobara, JP;
Toshinori Takagi, Nagaokakyo, JP;
Futaba Denshi Kogyo Kabushiki Kaisha, Mobara, JP;
Abstract
An aluminum film deposited copper material capable of being effectively used as a wiring and a heat sink for various electronic elements, an electrical wire, a cable, and the like while preventing diffusion and penetration of copper atoms into a different element. The copper element includes an aluminum film formed on a copper base according to an ion beam deposition techniques. Thus, the aluminum film may be deposited on the copper base with adhesion and denseness sufficient to block diffusion or exudation of copper atoms into the deposited aluminum film. Also, the aluminum film may be deposited in a thickness sufficient to ensure physical and electrical characteristics of copper.