The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 1988

Filed:

Apr. 18, 1985
Applicant:
Inventors:

Mitsuru Nitta, Tokyo, JP;

Tatsuo Satoh, Tokyo, JP;

Tatsuo Inoue, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361411 ; 174 36 ; 174 685 ; 361408 ; 361414 ;
Abstract

A large scale integrated circuit package is described wherein insulating layers of an organic material are provided between wiring layers to reduce the characteristic impedance of signal wiring. To avoid deformation of the organic insulating layers and subsequent damage to wiring layers, leads for connecting the circuits of an integrated circuit chip to electrode pads are mechanically connected to the electrode pads on an upper layer of organic insulating material by a gold-tin eutectic alloy.


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