Capacitive structure

Abstract

An improved capacity structure of the type comprising a group of capacitive layers of equal width, each including a dielectric substrate and a metallic area, which covers a major portion of an upper surface of the dielectric substrate and which extends to one edge of the dielectric substrate, a mass of conductive material covering each edge of such layer so as to provide electrical connections to and between the metallic areas extending to such edge. The metallized areas on alternate layers extend to opposite edges. A group of at least three dielectric layers of equal width, in stacked relation to each other, covers the group of capacitive layers at its top surface. A group of at least three dielectric layers of equal width, in stacked relation to each other, covers the group of capacitive layers at its bottom surface. Alternative ones of the layers of each group are offset laterally such that indentations are formed along each edge whereby the conductive masses, which substantially fill the indentations, bond the capacitive and dielectric layers tightly to each other. Additionally, a covering tape may be adhesively applied.