The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 1988
Filed:
Aug. 12, 1986
Kiyoshi Yoshikawa, Kawasaki, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A method and apparatus for handling semiconductor wafers comprises first and second tables having first and second elastic bases each of which has one surface on which a semiconductor wafer having a mirror surface is mounted with the mirror surface facing up and the other surface, and a plurality of through holes extending from one to the other surfaces thereof, a suction mechanism for reducing pressure in the through holes and chucking the semiconductor wafers to said bases and a projecting mechanism, provided to face the other surface of at least said second base, for urging the other surface to elastically deform said base corresponding thereto, thereby projecting a central portion of said base to project the mirror surface of the semiconductor wafer. The projecting mechanism includes projecting member having a conical end surface which is capable of being brought into contact with the other surface of the second elastic base.