The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 1988
Filed:
Oct. 20, 1986
Masumi Fukuta, Machida, JP;
Hisatoshi Narita, Hino, JP;
Fujitsu Limited, Kanagawa, JP;
Abstract
This invention relates to an ultra high speed semiconductor integrated circuit device, and in particular to a layout and connecting structure between lead terminals of a package and signal pads on a chip. The device includes a wiring board, positioned above the chip, which comprises an internal transmission line having a predetermined characteristic impedance on a dielectric insulating plate. The internal transmission line forms a strip line or coplanar transmission line including a signal line an ground conductor film. The wiring board internconnects the outer lead and bonding pads on the chip. The wiring between the internal transmission lines can cross by using a multi-layered structure. As the result of the structure of the present invention, transmission loss is reduced, and it is possible to design the wiring board having an optimum performance for ultra high speed operation of the high density integrated circuit device.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile