Lattice shaped arrangement type socket for ic package

Abstract

There is disclosed a socket for an IC package in which many IC lead wires project from the IC package and are arranged in vertical rows Y and lateral rows X, and the respective IC lead wires are arranged at equal pitches on the vertical rows Y and the lateral rows X. The socket, has a base plate having contacts and an IC mounting cover for moving the IC package between a contact engaging position and a release position. The cover is cross movably overlapped on the base plate. The IC mounting cover has many IC insertion holes arranged in a lattice shape. The respective rows X and Y of the IC lead wire insertion hole groups are inclined at the same angles with respect to respective sides of the cover. The diagonal lines W of the lattice shaped arrangement are arranged in parallel with two sets of opposite sides of the cover respectively. The repective rows X and Y of the contact groups are inclined at same angles with respect to the respective sides of the socket base plate. The diagonal lines W of the lattice shaped arrangement are arrranged in parallel with two sets of opposite sides of the socket base plate. The contacting pieces of the contacts are arranged as such that contacting points of the contacts and IC lead wires are facing in the direction of the diagonal lines W of the respective lattice shaped arrangements.