The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 1988
Filed:
Jul. 20, 1987
Edward J Furtek, E. Kingston, NH (US);
Other;
Abstract
The present invention proposes an apparatus or jig for the controlled spot heating of a substrate having soldered components therein and a designated locus to be heated for removal and/or replacement of a component. The apparatus comprises a frame and support means on the frame for holding and positioning the substrate with the locus to be heated along a designated axis of the frame. A rail at one end of the frame parallel to the designated axis holds a heating arm. The heating arm extends along an axis perpendicular to the designated axis and can be positioned along the rail. The heating arm ends in a directing means that is positioned over the designated axis and directs a heating medium, e.g. infra red radiation or a heated gas, onto a locus to be heated. The directing means limits the area of the application of the heating medium to only that area necessary for removal of the component. The amount, temperature, and time of application of the heating medium is controlled to just effect melting of the solder, after which application of the heating medium is discontinued and the component is removed. Preferably, a temperature sensor or thermocouple is associated with the directing means to measure the temperature of the heating medium and a timer is activated when the temperature of the heating medium is adequate to commence heating of the locus. Based on the experience of the operator, the timer is preset to allow the heating medium to be applied to the locus for a predetermined time sufficient to effect melting of the solder.