The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 1988
Filed:
Jan. 20, 1987
Haruo Komoto, Hyogo, JP;
Shigeharu Hamada, Hyogo, JP;
Yasuo Shiinoki, Hyogo, JP;
Katsumi Nagano, Fukuoka, JP;
Michio Sato, Aichi, JP;
Hiroo Goshi, Aichi, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Nippon Steel Corporation, Tokyo, JP;
Abstract
An apparatus in which plating currents of a plurality of successive plating cells are normally automatically controlled in accordance with line speed to maintain uniform plating thickness, and in which the number of energized plating cells is increased or decreased in accordance with line speed to maintain plating current density within a predetermined range, includes tracking or timing facilities for progressively changing plating currents of plating cells in correspondence with movement of the strip being plated through the cells after the number of energized cells has been increased or decreased so as to reduce plating thickness variation on the portion of the strip within the plating cells at the time of the change in the number of energized cells.