The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 1988
Filed:
Apr. 18, 1986
Applicant:
Inventors:
Kunihiko Kanazawa, Toyonaka, JP;
Masaru Kazumura, Takatsuki, JP;
Assignee:
Matsushita Electronics Corporation, Kadoma, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; C25D / ;
U.S. Cl.
CPC ...
156653 ; 156652 ; 1566611 ; 430314 ; 430317 ;
Abstract
A thick resist layer is formed on a thin metal film and the resist layer is dry-etched by using an SiO.sub.2 mask formed selectively on the resist layer, and a thick wiring metal layer is formed by plating method with using the dry-etched resist layer, which has perpendicular side walls as a mask, thereby to form a low resistance and fine-patterned wiring metal layer.
Quick Actions:
Kanazawa, Kunihiko. (1988). Method for manufacturing a perpendicular sidewalled metal layer on a (U.S. Patent No. 4747909). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4747909
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile