The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 1988

Filed:

Sep. 18, 1986
Applicant:
Inventors:

Hiroo Ikegame, Tokyo, JP;

Shigeo Nonaka, Yokohama, JP;

Takuro Ito, Yokohama, JP;

Toshiaki Matsumoto, Tokyo, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F / ;
U.S. Cl.
CPC ...
165168 ; 165 804 ; 357 82 ;
Abstract

In a heat sink for semiconductor elements and the like, a pipe made of a heat-conductive material such as copper, aluminum and the like is bent at a middle portion thereof and wound such that a forward flow passage and a return flow passage for a liquid coolant are both formed into a spiral shape with the bent portion held at the center of the spiral.


Find Patent Forward Citations

Ikegame, Hiroo. (1988). Method for producing heat sink and heat sink thus produced (U.S. Patent No. 4747450). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4747450

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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