The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 1988

Filed:

Nov. 18, 1985
Applicant:
Inventor:

Hiroaki Nishi, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 68 ; 357 71 ;
Abstract

Disclosed is an integrated semiconductor circuit device which has a plurality of cell arrays formed in parallel on a surface region of the substrate, and a three-layer wire formed on the substrate and between each cell array. The direction of a wire track of a second layer wire is originally determined in a direction parallel to the cell arrays, and the direction of wire tracks of first and third layer wires is originally determined in a direction orthogonal to the originally determined direction of the wire track of the second layer wire. The first layer wire and the third layer wire are formed on the same wire track. Part of the third layer wire is formed on a wire track orthogonal to the originally determined direction of the wire track of the third layer, and the third layer wire and the second layer wire are connected to each other on the wire track which is orthogonal to the originally determined direction of the wire track of the third layer wire.


Find Patent Forward Citations

Loading…