The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 1988
Filed:
Jan. 15, 1987
Applicant:
Inventors:
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; B44C / ; C03C / ; C03C / ;
U.S. Cl.
CPC ...
156637 ; 134 32 ; 134 34 ; 156643 ; 156646 ; 156653 ; 156657 ; 1566591 ; 156662 ; 156345 ;
Abstract
A treatment method for plate-shaped substrate capable of uniformly performing the treating operation, performing a large amount of treatment, and facilitating the automation of the work independently of the surface nature of the substrate such as base plates of Si wafer for integrated circuit manufacturing use. The method is achieved by making it easier for the whole substrate surface to be wetted with the treatment liquid, through exposing the substrate to liquid or gas material which is soluble mutually with a treatment liquid prior to treatment with the treating liquid, to avoid treatment and thus uneven treatment to improve the yield.