The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 1988
Filed:
Dec. 09, 1985
Yoshitugu Imano, Nara, JP;
Kazuhito Ozawa, Nara, JP;
Yoshitomo Kitanishi, Kashihara, JP;
Katsuhide Shino, Nara, JP;
Yukihiro Inoue, Kashihara, JP;
Yoshinori Oogita, Nara, JP;
Kazuhiro Nakao, Nara, JP;
Shigeki Komaki, Nara, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
A method for bonding a LSI chip having terminals on a wiring base having electrodes which comprises the steps of coating a heat sensitive adhesive on the surface of a wafer forming a plurality of LSI chips, sprinkling electrically conductive particles thereon, dopping the electrically conductive particles, scribing the wafer to be divided into each of the LSI chips, positioning each of the terminals of the LSI chip and each of the electrodes of the wiring base face to face, and bonding the LSI chip on the wiring base.