The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 1988

Filed:

Sep. 25, 1986
Applicant:
Inventors:

Hiroshi Horikawa, Nikko, JP;

Norimasa Satou, Utsunomiya, JP;

Akihiro Ooguri, Imaichi, JP;

Kenichi Omata, Nikko, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C / ;
U.S. Cl.
CPC ...
420477 ; 420494 ; 148413 ; 148434 ;
Abstract

A high electroconductive copper alloy is disclosed which contains 0.003 to 1.0 wt % of Zn, 0.005 to 0.1 wt % of Mg and the remainder of Cu. Not more than 0.1 wt % of the total amount of either one or more of Cr, Mn, Fe, Co, Ni, Y, Sn, Si and Zr may be contained further, while the amount of oxygen contained is confined to not more than 100 ppm in both cases.


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