The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 1988
Filed:
Mar. 25, 1986
Ryoichi Kajiwara, Hitachi, JP;
Takao Funamoto, Hitachi, JP;
Mitsuo Katoo, Hitachi, JP;
Tomohiko Shida, Hitachi, JP;
Takeshi Matsuzaka, Hitachi, JP;
Hiroshi Wachi, Hitachi, JP;
Kazuya Takahashi, Katsuta, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A semiconductor module cooling structure comprises a housing having a passage through which a cooling fluid flows; a cooling block to which the cooling fluid is supplied from the housing and which has an electrical insulating layer at the bottom portion and is combined with a semiconductor chip through the electrical insulating layer; and a bellows which is connected between the housing and the cooling block. The cooling fluid is supplied to the cooling block through the bellows. The bellows is formed in a manner such that a plurality of substantially plane ring-like metal plates are laminated, pressed, diffused, joined, and thereafter stretched and molded.