The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 1988
Filed:
Jul. 01, 1986
James M Henderson, Scottsdale, AZ (US);
Terry L Gibbs, Tempe, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A resistive element is formed on a printed circuit board using only printed circuit board fabrication techniques. Two printed circuit board strata are laminated together into a multi-layer printed circuit board. A desired trace pattern is etched into a first layer of a first stratum that has first and second conductive metallic layers clad to opposing sides of a first dielectric substrate. A bi-metallic clad substrate having a resistive layer clad to a first side of a second dielectric substrate, a third conductive layer clad to the resistive layer, and a fourth conductive layer clad to a second side of the second dielectric substrate represents the second stratum. The third conductive layer is etched to leave only pads. The resistive layer is etched to form resistive elements of desired resistivity between the pads. When the two strata are laminated together, the pads couple to the trace pattern at desired locations.