The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 1988
Filed:
Jun. 16, 1986
Toyo Kawase, Atsugi, JP;
Yukio Okada, Fujisawa, JP;
Yujiro Kawamura, Atsugi, JP;
Masashi Ohno, Hatano, JP;
Takashi Sugimoto, Yokkaichi, JP;
Nissan Motor Co., Ltd., Yokohama, JP;
Abstract
Disclosed is an automobile bumper which is formed of a thermoplastic multicomponent resin composition and which is improved in weatherability and impact resistance at low temperatures and also in surface glossiness. Essentially the resin composition is a blend of 22-28 wt % of a hydrogenated block copolymer of an aromatic vinyl compound such as styrene and a conjugated diene such as butadiene, 32-56 wt % of a propylene-ethylene block copolymer in which the content of ethylene is 1-10 wt % and 22-28 wt % of an ethylene-propylene copolymer rubber. Optionally, up to 5 wt % of talc and/or up to 7 wt % of low-pressure low-density polyethylene may be added. Some physical properties of the ingredients are specified such that the resin composition has a melt index not lower than 5 g/10 min at 230.degree. C. under load of 2.16 kg and a modulus of elasticity in bending in the range from 2000 to 4000 kg/cm.sup.2.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile