The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 1988
Filed:
Apr. 28, 1987
Isao Sasaki, Hiroshima, JP;
Kozi Nishida, Ohtake, JP;
Masaru Morimoto, Ohtake, JP;
Kenji Kushi, Ohtake, JP;
Mitsubishi Rayon Co., Ltd., Tokyo, JP;
Abstract
A heat-resistant resin molded article excellent in abrasion resistance, surface smoothness, solvent resistance, durability and adhesiveness between base material and cured film, consisting of (1) a resin molded article composed of 2% by weight or more of a structural unit represented by the following structural formula ##STR1## (wherein R is a hydrogen atom, an alkyl group, an aryl group or an alicyclic group of 1 to 20 carbon atoms) and 98% by weight or less of an ethylenic monomer unit and (2) a cured film formed on the surface of said resin molded article by curing a crosslinking-curable resin material containing 30% by weight or more of at least one monomer having three or more (meth)acryloyloxy groups in one molecule, as well as a process for producing said heat-resistant resin molded article.