The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 1988

Filed:

Jul. 16, 1986
Applicant:
Inventors:

Francois Boulitrop, Sceaux, FR;

Eric Chartier, Chatenay Malabry, FR;

Nicolas Szydlo, Ris Orangis, FR;

Bernard Hepp, Neuilly sur Seine, FR;

Nicole Proust, Palaiseau, FR;

Assignee:

Thomson-CSF, Paris, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; B44C / ;
U.S. Cl.
CPC ...
357 30 ; 156653 ; 156656 ; 156657 ; 156662 ; 2502 / ; 357-2 ; 357 49 ; 357 58 ; 358212 ; 437-3 ;
Abstract

In a light image detector, a substrate is covered with a first layer of conductive material on which is formed a two-dimensional matrix array of photodiodes in the form of pads arranged in rows and columns and each comprising a layer of amorphous semiconductor material doped with a predetermined type (n-type or p-type), a layer of undoped amorphous semiconductor material, a layer of amorphous semiconductor material doped with another predetermined type (n-type or p-type), a second layer of conductive material, each photodiode being insulated from adjacent photodiodes by means of insulating material. On the insulating material, columns of material are disposed along the columns of photodiodes and are each formed by a layer of metallic material and a layer of doped amorphous semiconductor material. Connection elements are each connected to a photodiode through the layer of conductive material of the photodiode, are located in proximity to a column and each formed by a layer of metallic material and a layer of doped amorphous semiconductor material. Rows of material are disposed along the lines of photodiodes and overlap the columns as well as at least one connection element at each point of intersection of a row and a column. Each row is formed by a layer of undoped amorphous semiconductor material, an insulating layer and a layer of metallic material.


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