The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 1988
Filed:
Jan. 27, 1987
Applicant:
Inventors:
Gyozo Toda, Hino, JP;
Takashi Kuroki, Yokohama, JP;
Shousaku Ishihara, Chigasaki, JP;
Tsuyoshi Fujita, Yokohama, JP;
Naoya Kanda, Yokohama, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B / ; H05K / ;
U.S. Cl.
CPC ...
264 61 ; 264 65 ; 427 96 ; 4271262 ; 4273762 ; 428209 ; 428210 ; 428901 ; 501 69 ;
Abstract
A ceramic wiring substrate and a process for producing the same having a conductive layer, obtained by sintering a conductive paste comprising 85 to 97% by weight of a tungsten powder and 15 to 3% by weight of a sintering additive (for conductive metal) having a specified composition, on a mullite ceramic substrate.