The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 1988
Filed:
Jun. 04, 1987
Applicant:
Inventors:
Assignee:
Brown Boveri & Cie AG, Mannheim-Kafertal, DE;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
361382 ; 165 804 ; 16510433 ; 174 / ; 357 82 ; 361385 ;
Abstract
A semiconductor power module includes a substrate formed of metallized ceramic, at least one semiconductor power component with a base surface soldered to the metallized ceramic, and at least one heat conduit integrated into the semiconductor power module. The heat conduit includes a condensation area having a larger surface than the base surface, over which dissipation heat from the semiconductor power component is distributed.