The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 1988
Filed:
Oct. 16, 1985
Katsumi Hayashi, Mentor, OH (US);
Gregory A Lentz, Twinsburg, OH (US);
Intera Company, Ltd., a Tennessee Limited Partnership, Cleveland, TN (US);
Abstract
A process for improving the hygroscopic, soil release and other properties of a polymer substrate is provided in which the substrate is contacted with a suitable aqueous mixture containing a water-soluble cross-linking vinyl monomer and an organic hydrophobic carrier compound at a temperature of between about 40.degree. C. to 100.degree. C. Polymerization of the monomer is thereafter initiated by a chemical or physical initiator to form a vinyl polymer evenly disposed on the substrate. The hygroscopic, soil release and other surface properties of the substrate are thereby improved. The mixture may be in the form of an emulsion wherein the hydrophobic carrier compound is emulsified by an appropriate agent. The invention also pertains to the improved substrates prepared in accordance with the present process.