The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 1988

Filed:

Apr. 03, 1987
Applicant:
Inventors:

Shigeru Goi, Moriyama, JP;

Taizo Sugihara, Omihachiman, JP;

Hiroshi Sonoda, Shiga, JP;

Assignee:

Chisso Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D / ;
U.S. Cl.
CPC ...
156180 ; 156285 ; 156441 ;
Abstract

In a process for producing tubular shaped fibrous articles of small diameter by heating and cooling a fibrous bundle containing at least 20 weight % of hot-melt-adhesive composite fibers, the improvements comprise using a shaping apparatus including an injecting chamber, an injecting hole formed in the wall of the chamber, a fibrous bundle outlet provided with a nozzle of a desired shape in cross-section, a cylindrical pipe for introducing the fibrous bundle, which has a cross-sectional area larger than that of the outlet, is located at a position opposite to the outlet and projects toward the outlet and terminates in the injecting chamber, and a core pipe which is open at its base on the outside of the injecting chamber, has its one end inserted through the cylindrical pipe and extending into the nozzle through the injecting chamber, and having a vent in its portion exposed within the injecting chamber, and passing the fibrous bundle through the cylindrical pipe to the outlet, while injecting a hot compressed gas through the injecting hole, thereby to heat and shape the fibrous bundle to and at its hot-melt-adhesive temperature.


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