The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 1988
Filed:
Jul. 17, 1986
Applicant:
Inventor:
Kenshi Kondo, Tokyo, JP;
Assignee:
Nihon Den-Netsu Keiki Co. Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ; B23K / ;
U.S. Cl.
CPC ...
228 37 ; 2281801 ;
Abstract
A soldering apparatus is disclosed having a first vessel through which printed circuit boards are transferred for soldering by a combination of a solder wave and hot vapors of a heat transfer liquid, a second vessel in which heat transfer liquid is heated and vaporized, a gas feed conduit extending between the first and second vessels and having a pump for feeding the vapors produced in the second vessel to the first vessel, and a liquid recycling conduit extending between the first and second vessels and having a pump for recycling heat transfer liquid formed by the condensation of the vapors and collected in the first vessel to the second vessel.