The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 1988

Filed:

Mar. 27, 1986
Applicant:
Inventors:

Akira Miyauchi, Kawasaki, JP;

Hiroshi Nishimoto, Tokyo, JP;

Tadashi Okiyama, Kawasaki, JP;

Hiroo Kitasagami, Kawasaki, JP;

Masahiro Sugimoto, Yokosuka, JP;

Haruo Tamada, Yokohama, JP;

Shinji Emori, Urawa, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 80 ; 357 71 ; 357 72 ; 357 74 ;
Abstract

A semiconductor device provided with signal lines which connect a chip, provided at a top portion of a package, with external terminals provided at a bottom portion of the package. The signal lines have portions formed along side surfaces of the package. Ground surfaces are formed at predetermined distances on two sides of the high-speed signal lines. A coplanar waveguide is formed by the high-speed signal lines and the ground surfaces, so the impedance of vertical portions of the high-speed signal lines is matched to the circuits connected thereto.


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