The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 1988
Filed:
Jul. 18, 1986
Lance R Kaufman, Mequon, WI (US);
Other;
Abstract
An electrical circuit assembly (2) includes a heat sink (4), ceramic substrates (6, 6a) on top of the heat sink (4), heat generating electrical components (8a), including electronic circuit elements (10,10a) and a plurality of flat planar connecting lead frames (12,12a, (14,14a and 16,16a) on top of the substrates (6,6a) and a printed circuit board (26) on top of the flat lead frames (12,12a 14,14a and 16,16a). The printed circuit board (26) has a conductive pattern (28) on its underside electrically engaging and laying flat along the top planar surface of the flat lead frames (12,12a, 14,14a and 16,16a). A plurality of deformable rivets (52, 54, 56 and 58) extend downwardly through respective apertures (60, 62, 64 and 66) in the printed circuit board (26) and through respective apertures (68, 70, 72 and 74) in the heat sink. The rivets (52, 54, 56 and 58) have enlarged heads (76, 78, 80 and 82) engaging the top of the printed circuit board (26), and have bottom ends (84, 86, 88 and 90) deformed to engage the bottom of the heat sink (4) and compressively clamp the circuit arrangement in good heat transfer relation. The rivets (52, 54, 56 and 58) provide the sole clamping force, without nuts and bolts, etc.