The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 1988
Filed:
Nov. 21, 1985
Bernard Lacruche, Chelles, FR;
Thomson-CSF, Paris, FR;
Abstract
A micropackage (1) for encapsulating an electronic component (5), includes a body fitted with a plurality of external connection tabs (2) which pass underneath the body (at 3) and which terminate in tips (17) located underneath the body. The body is made of a material which is not wettable by solder (e.g. plastics or ceramics). At least one groove (15) is formed in the underside of the body in the proximity of said tips (17). The, or each, groove is filled with solder (16) in contact with the tips. This enables the micropackage to be placed on an interconnection substrate (8) having a pattern of conductive tracks (10) matching the external connection tabs (2), and to be soldered thereto by melting the solder so that it is drawn along the tabs by capillarity to occupy the spaces (18) around the points (3) where the tabs (2) touch the tracks (10).