The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 1988

Filed:

Aug. 18, 1986
Applicant:
Inventors:

Robert L Carlson, Chicago, IL (US);

Joseph G Murglin, Norridge, IL (US);

Assignee:

AT&T Teletype Corporation, Skokie, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ; B25B / ; B25B / ; B25F / ;
U.S. Cl.
CPC ...
29764 ; 29741 ; 29758 ;
Abstract

A tool for insertion and extraction of a packaged IC to and from a socket includes a pair of flexible, parallel arms joined at two ends by a 'U' shaped portion. The free ends of the two when moved towards each other are adapted to grip the IC at opposite ends and allow a rocking motion to be applied to loosen the pins of the IC within the socket and then for a lifting force to be applied to remove the IC the socket, all with minimum distortion of the pins. A plunger having a base which is positioned and is free to move between the two parallel walls within the 'U' is used to insert an IC into its socket. The IC is positioned between the two walls of the 'U' with the pins of the IC pointing outwards and the surface opposite the pins in contact with the base of the plunger. The IC is retained within the 'U' by a predetermined interference fit between the walls and the IC. The tool positions the IC over the socket and a downward force is applied to the plunger to push the IC out of the 'U' portion and into the socket.


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