The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 1988

Filed:

May. 16, 1986
Applicant:
Inventors:

Hazen L Hoyt, III, Costa Mesa, CA (US);

John D Sanders, Tustin, CA (US);

Jon C Goldman, Orange, CA (US);

William R Mello, Huntington Beach, CA (US);

Assignee:

Thermco Systems, Inc., Orange, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B65B / ;
U.S. Cl.
CPC ...
414416 ; 414403 ; 414786 ;
Abstract

Semiconductor wafers in plastic cassettes are loaded into (and later unloaded from) an input/output station serving a CVD furnace and thereafter the cassettes are non-manually transported by a programmable elevator to and from a flat-finder, a wafer transfer machine (where the wafers are transferred to a boat) and in-process storage. The boats are non-manually transported by a second programmable elevator to and from the wafer transfer machine, in-process boat storage and a boat loader (or process chamber directly). The cassettes can be loaded or unloaded while one or both of the elevators are operating. Up to eight human assisted steps are reduced to only two such steps. Furnaces having more than one processing chamber have a loading station, in-process cassettes and boat storage and boats dedicated to each processing chamber so that there is no cross contamination between processing chambers caused by the boats and the cassettes in which wafers are delivered to the process are the same cassettes in which process wafers are returned to the input/output station so that there is no cross contamination of the wafers caused by the cassettes.


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