The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 1988
Filed:
Jan. 30, 1987
Thaddeus Wojcik, Hopewell, NJ (US);
American Telephone and Telegraph Company, New York, NY (US);
Abstract
The present invention relates to a method for depositing a viscous material (11), such as solder paste, onto a substrate (16), such as a printed circuit board. The solder paste is expelled (12) out from a dispenser (20) into a void between a pair of flexible members (30) extending therefrom for contact with a foraminous member (12) such as a stencil, proximate the printed circuit board. A relative motion is imparted between the dispenser and the foraminous member so that at least one of the flexible members forces the solder paste through the openings in the stencil and onto the circuit board. In accordance with the invention, the dispenser is pivoted when the relative motion is imparted between the dispenser and the stencil to raise the leading one of the flexible members a predetermined distance from the stencil. In this way, the solder paste expelled from the dispenser will remain substantially confined between the flexible members, yet be allowed to mix with whatever portion of the solder paste (typically flux) remains on the stencil after the previous pass of the dispenser thereacross.