The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 1988
Filed:
Jul. 31, 1985
Applicant:
Inventors:
Akira Yoshizumi, Yokohama, JP;
Hisayuki Hirai, Chiba, JP;
Kazutaka Matsumoto, Yokohama, JP;
Shinetsu Fujieda, Kawasaki, JP;
Michiya Higashi, Kawasaki, JP;
Assignee:
Kabushiki Kaisha Toshiba, , JP;
Primary Examiner:
Int. Cl.
CPC ...
C08L / ;
U.S. Cl.
CPC ...
523436 ; 523438 ; 523456 ; 525 58 ;
Abstract
An epoxy resin composition for encapsulation of semiconductor device comprises the components (a), (b), (c) and at least one of the components (d) and (e) as shown below:
Yoshizumi, Akira. (1988). Epoxy resin composition for encapsulation of semi-conductor device (U.S. Patent No. 4719255). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4719255
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile