The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 1988

Filed:

Jan. 09, 1987
Applicant:
Inventor:

Behrooz Minaee, Campbell, CA (US);

Assignee:

Ultraphase Equipment, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C / ; C03C / ; C03C / ; B29C / ;
U.S. Cl.
CPC ...
156643 ; 156635 ; 156646 ; 156655 ; 156668 ; 156345 ; 134-1 ; 427 541 ;
Abstract

Apparatus and method for removing organic polymers, such as photoresist, from the surface of an object, such as a semiconductor wafer. The apparatus comprises a microwave energy source and a reaction chamber housing an ultraviolet lamp and a platform for holding a semiconductor wafer. A portion of the chamber's exterior, between the ultraviolet lamp and the microwave energy source, is permeable to microwaves. The reaction chamber has an inlet and an outlet for passing a reaction gas through the reaction chamber. The platform is situated so that the full surface of a semiconductor wafer thereon is exposed to light emitted by the ultrtaviolet lamp which responds to microwave stimulation from the microwave energy source by emitting ultraviolet radiation having a preselected wavelength between 100 and 300 angstroms. Photoresist can be stripped from a semiconductor wafer on the platform by energizing the ultraviolet lamp while passing a reaction gas through the reaction chamber and thereby ablating organic polymers and impurities from the surface of the semiconductor wafer.


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