The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 1988
Filed:
Jan. 28, 1987
Hiroshi Ishikawa, Osaka, JP;
Keisuke Oguro, Osaka, JP;
Hiroshi Suzuki, Osaka, JP;
Akihiko Kato, Osaka, JP;
Teruya Okada, Osaka, JP;
Shizuo Sakamoto, Osaka, JP;
Iwao Nishimura, Osaka, JP;
Keizo Sakaguchi, Hyogo, JP;
Agency of Industrial Science & Technology, both of, JP;
Kurimoto Ltd., both of, JP;
Abstract
This invention discloses a compact of hydrogen adsorption alloy principally composed of a metal hydride in which all surfaces of fine particles of hydrogen adsorption alloy are completely coated with a dissimilar metal by plating, without effecting reactivity and a porous material of high thermal conductivity is infiltrated with the fine particles of alloy to be formed into a compact by compression molding. By this construction, it is possible to improve decline in the thermal conductivity or dropping of the fine particles out of cells of the porous material caused by micronization as a result of repeated uses of the hydrogen adsorption alloy are avoided.