The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 1988
Filed:
Feb. 24, 1986
Applicant:
Inventors:
Tsvi Goldenberg, Allentown, PA (US);
Lawrence A Greenberg, Allentown, PA (US);
Kenneth P Moll, Philipsburg, PA (US);
Assignee:
American Telephone and Telegraph Company, AT&T Bell Laboratories, Murray Hill, NJ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228179 ; 228-45 ;
Abstract
Disclosed is a method of forming strong bonds between gold spheres and contact pads on semiconductor devices and the resulting product. The spheres are formed by establishing ball bonds with wire bonding techniques and then severing the wire. The wire material is a gold alloy including palladium which forms a weakened portion above the ball bond so that the wire can be easily broken off.