The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 1987
Filed:
Apr. 03, 1986
Applicant:
Inventors:
Michael O King, Fremont, CA (US);
Marvin S Keshner, Mtn. View, CA (US);
Assignee:
Hewlett-Packard Company, Palo Alto, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
29841 ; 295691 ; 357 66 ; 361387 ;
Abstract
The invention is a method of packaging whole or large silicon wafers that provides support for the wafer, eliminates thermally or package-induced wafer strain, and allows selection of a mounting substrate material that provides optimal heat conduction.