The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 1987
Filed:
Feb. 25, 1986
Kunimichi Nakao, Yokohama, JP;
Fujitsu Limited, Kanagawa, JP;
Abstract
A method and apparatus for adhering an adhesive-backed tape or sheet to the back surface of a semiconductor wafer having electrical patterns already formed on the front surface thereof. The apparatus comprises a housing forming a vacuum working chamber containing a circular supporting table for the semiconductor wafer and a roller mechanism for exerting pressure on an adhesive-backed tape or sheet having the adhesive surface thereof located above and facing the semiconductor wafer. In the adhering method, the adhesive-backed tape or sheet is first adhered only at the peripheral edges of the semiconductor wafer, and then the central portion of the adhesive-backed tape or sheet is drown against the semiconductor wafer by a change in pressure in the vacuum working chamber. In this method, since an external force is not applied to the front surface of the semiconductor wafer, the electrical patterns thereon will not be damaged during the adhesion of the adhesive-backed tape or sheet to the back surface of the semiconductor wafer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile