The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 15, 1987

Filed:

Apr. 14, 1986
Applicant:
Inventors:

Helmut Moll, Erlangen, DE;

Gerd Wiegel, Langenzenn, DE;

Josef Schindler, Regensburg, DE;

Wilfried Scherer, Rieden, DE;

Kurt Marth, Regensburg, DE;

Assignee:

Siemens Aktiengesellschaft, Berlin and Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228111 ; 156 732 ;
Abstract

A method for bonding a lacquer insulated wire to a metallic support is disclosed. The method is carried out in two steps: First, the wire is exposed to ultrasonic energy so that the lacquer is broken up and the wire is deformed in a certain area and welded to the support. Then the entire area of deformation is enclosed with a thixotropic adhesive. In preferred embodiments, the method is used for bonding the winding wire of a HF-inductor coil with contact elements shaped as wires or lugs.


Find Patent Forward Citations

Loading…