The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 1987
Filed:
Jun. 04, 1986
Masayasu Fujisawa, Ninomiya, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A method and an apparatus for severing a workpiece into wafer slices, wherein the inclined surface to be cut can be processed to remove protrusions or impressions which occur around the cut surface. The workpiece has a front end portion which is cut by a cutting tool and a rear end portion which is inclined with respect to the central position of the surface of the workpiece to be cut. This central position is the center of rotation about which the workpiece is rotated to generate a cone shape. When the workpiece is fed axially for cutting to obtain wafers, the central position of the workpiece surface to be cut is held at a constant position so that the workpiece can be cut continuously at a constant angle of inclination. The front end portion of the wafer being cut is rotated while being pulled in a direction from the workpiece until the completion of the severing operation. Then, when the severing has been completed, the process wafer is rotated and pressed toward the workpiece so that protrusions, impressions or grooves can be removed from around the central portion of the cut end portion.