The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 1987
Filed:
Dec. 20, 1985
Applicant:
Inventors:
Michael J Pryor, Woodbridge, CT (US);
Charles J Leedecke, Northford, CT (US);
Norman G Masse, Wallingford, CT (US);
Assignee:
Olin Corporation, New Haven, CT (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361411 ; 29846 ; 174 685 ; 361397 ; 361414 ; 428209 ;
Abstract
The present invention is directed to the process of forming a multi-layer or hybrid circuit assembly. The assembly includes at least one ceramic substrate having a deoxidized or oxygen free copper alloy foil bonded thereto by a bonding glass. The copper alloy foil may be a circuit to which a resistive metal alloy tape can be bonded so as to provide a path of precise resistance. Also, layers of foil may be glass bonded to a substrate and stacked to form multi-layer circuits.