The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 1987

Filed:

Apr. 08, 1985
Applicant:
Inventor:

David B Wamstad, Roseville, MN (US);

Assignee:

Honeywell Inc., Minneapolis, MN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L / ;
U.S. Cl.
CPC ...
338-4 ; 338-2 ; 338 42 ; 338 47 ;
Abstract

Disclosed is a pressure transducer package comprising a housing and a substantially cylindrical chamber formed into the housing, a first end of the chamber comprising a substantially flat surface. The package further comprises a substantially cylindrical interface plate having first and second substantially flat end surfaces, one end surface of the interface plate facing the first end surface of the chamber. The package further comprises a pressure transducer comprising a pressure sensitive silicon die mounted to a substantially cylindrical support member. The support member comprises first and second substantially flat end surfaces. The other end surface of the interface plate faces one end surface of the support member. The housing comprises plug apparatus for hermetically sealing the chamber, the plug apparatus having a substantially flat surface forming a second end of the chamber. A compressive ring is located between the other end of the support member and the substantially flat surface of the plug apparatus. The plug apparatus comprises means for compressing the interface plate, pressure transducer, and compressive ring together and toward the first end of the chamber. The housing includes an aperture for connecting the silicon die to a pressure medium.


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