The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 1987
Filed:
Feb. 11, 1986
Haruo Kojima, Yokohama, JP;
Hidehiko Akasaki, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A package for a semiconductor device comprising three laminated ceramic sheets: a first sheet provided with a chip stage on the upper surface thereof, a second sheet provided with a first chip-inserting window for exposing the surface of the chip stage and provided with an internal conductor pattern formed at least on the upper surface thereof; and a third sheet provided with a second window for exposing the first chip-inserting window and for exposing a wire-bonding area located adjacent to the periphery of the first chip-inserting window, characterized in that marks for recognizing the location of the first chip-inserting window are essentially aligned, this alignment being effected in that the first chip-inserting window and marks for recognizing the location of the first chip-inserting window are simultaneously formed with the same mold, the marks for recognizing the location of the first chip-inserting window being formed in the wire-bonding area of the second green sheet.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile