The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 1987

Filed:

Mar. 13, 1986
Applicant:
Inventors:

Yukio Sekiguchi, Higashimatsuyama, JP;

Hiroyasu Funakubo, Tokyo, JP;

Hitoyuki Sakanoue, Itami, JP;

Osamu Komura, Itami, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228-31 ; 228-41 ; 228221 ;
Abstract

The bonding apparatus has a holding device, a pressing device for pressure welding substances to be bonded to each other, and a superhigh vacuum bonding chamber provided with the holding device and the pressing device. A superhigh vacuum bonding preparatory chamber is connected with the superhigh vacuum bonding chamber through a gate valve and a conveyor is arranged for conveying the substances to be bonded between the superhigh vacuum bonding preparatory chamber and the superhigh vacuum bonding chamber. The preparatory chamber is provided with a rotary preparatory table having a plurality of stages for releasably supporting holders for holding the substances to be bonded, the preparatory table being moved to successive positions to register with the conveyor.


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