The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 1987
Filed:
Aug. 26, 1986
Yukio Yamaguti, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A method for forming a package, and corresponding package structure are disclosed. An electronic component is mounted on a substrate via a spacer, and the component is electrically connected to wiring embedded in the substrate. A space is defined in between the component, the spacer, and the substrate by the electrical connecting path. A first silicone material is filled within said defined space, and a second relatively more hardened silicone material is disposed in an area outside of said defined space and covering the electrical connecting path and portions of the upper surface of the substrate. More particularly, some first silicone material may also be disposed outside the defined space, and covered by the second silicone material. The second silicone material is at first in liquid form and of less viscosity than the first silicone material when originally disposed, and is subsequently hardened by either heating or irradiation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile