The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 1987
Filed:
Feb. 22, 1985
Detlef Haberland, Steinebach, DE;
Michael Langenwalter, Stockdorf, DE;
Klaus Panzer, Munich, DE;
Hans G Rosen, Hohenschaeftlarn, DE;
Lothar Spaeter, Annweiler, DE;
Werner Spaeth, Holzkirchen, DE;
Bernd Seibert, Ottobrunn, DE;
Helmut Haltenorth, Munich, DE;
Siemens Aktiengesellschaft, Berlin and Munich, DE;
Abstract
In an opto-electronic module housing for positioning an end of an optical fiber in a desired position relative to an active area of an opto-electronic component characterized by the housing including an optical fiber connector having an adjustment plane at one end and an arrangement for holding an end of an optical fiber with the axis of the fiber on an axis extending perpendicular to the adjustment plane with the end being a fixed distance from the plane, an adjustment frame being securable to the adjustment plane and an arrangement for locating an opto-electronic component or transducer relative to the frame including a plate having the component mounted thereon. The arrangement including the plate is securable to the frame and the frame and the arrangement enable adjusting the component in three spatial directions relative to the end of the fiber to obtain an optimum adjustable position. The module housing can be received in an outer gas and light-tight housing in which case the connector extends through a wall of a can or member forming part of the outer housing which coacts with a lid to enable access to the interiorly disposed module housing. The component can either be a light-emitting opto-electronic component or a light-opto-electronic receiving component.